Title :
Soldered flip chip IC´s in automotive applications
Author :
Thor, V. ; Appel, K. ; Nover, M. ; Sommerfeld, P.
Author_Institution :
Philips Mikroelektronik Module, Krefeld, Germany
Abstract :
During recent years, we have accumulated a great deal of experience with high volume production of soldered flip-chips in small modules for automotive applications. We have processed more than 20 million flip chips with excellent results in terms of processing and reliability. There are several advantages for using hybrid flip chip modules for these applications. The reasons are given in this paper. Problems related to printing, mounting and soldering had to be solved, especially with respect to throughput. We therefore decided to screen print and place with a high speed placer, though stencils and fine pitch placers give higher accuracies. Nevertheless, we reached 2000 thermal cycles from -40°C to +140°C with this configuration without test failures; factory fall-off is less than 10 ppm
Keywords :
automotive electronics; flip-chip devices; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; microassembling; modules; soldering; thermal stresses; thick films; -40 to 140 C; automotive applications; factory fall-off; fine pitch placers; flip chip processing; flip chip reliability; flip chips; high speed placer; hybrid flip chip modules; mounting; placement; printing; screen printing; soldered flip chip ICs; soldered flip-chips; soldering; stencils; test failures; thermal cycles; throughput; volume production; Alternators; Application specific integrated circuits; Automotive applications; Ceramics; Conductors; Flip chip; Printing; Regulators; Soldering; Temperature distribution;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1998. IEMT-Europe 1998. Twenty-Second IEEE/CPMT International
Conference_Location :
Berlin
Print_ISBN :
0-7803-4520-7
DOI :
10.1109/IEMTE.1998.723053
