• DocumentCode
    1951686
  • Title

    Trends and challenges in lead free soldering

  • Author

    Lopes, Diogo ; Pinto, Margarida ; Assunção, Eurico ; Coutinho, Luisa

  • Author_Institution
    Inst. de Soldadura e Qualidade, Oeiras, Portugal
  • fYear
    2012
  • fDate
    16-18 April 2012
  • Firstpage
    42378
  • Lastpage
    42622
  • Abstract
    The implementation of new EU environmental directives, the restriction of the use of certain hazardous substances (RoHS) and waste Electrical and Electronic Equipment (WEEE) which involve ban of lead from electronic and electric products and equipments introduced constrains in all the value chain. Soldering new design lead free devices and equipments, testing and comparison with service behaviour and life cycle waste management, introduced a challenge to all the actors and mainly to SMEs. This paper summarizes the work and results developed by ISQ in several in-house and multi-partners projects in the last ten years taking into account the barriers still existing in some industrial sectors and end users, due the reliability and standard proceedings.
  • Keywords
    electrical products industry; electronics industry; soldering; waste management; EU environmental directives; SME; electric products; electronic products; hazardous substances; lead free devices; lead free soldering; life cycle waste management; service behaviour; value chain; waste electrical equipment; waste electronic equipment; Bismuth; Copper; Lead; Soldering; Tin; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
  • Conference_Location
    Cascais
  • Print_ISBN
    978-1-4673-1512-8
  • Type

    conf

  • DOI
    10.1109/ESimE.2012.6191697
  • Filename
    6191697