DocumentCode
1951734
Title
Recent progress in SiC power device developments and application studies
Author
Sugawara, Yoshitaka
Author_Institution
Gen. R&D Center, Kansai Electr. Power Co., Amagasaki, Japan
fYear
2003
fDate
14-17 April 2003
Firstpage
10
Lastpage
18
Abstract
Recent progress in SiC device developments is comprehensively surveyed and state of the art SiC power devices including diodes and switching devices are reported. The highest BVs of 19.5kV and 12.5kV are achieved for SiC pn diodes and SiC switching devices respectively. The smallest RonS of 1/420 and 1/230 for Si theoretical limits are achieved by SiCSBD and SiC FET respectively. New SiC bipolar devices sich as the SIJFET and the SICGT have been introduced to increase the current capability under the restriction in chip size, which is due to the presence of several crystal defects. Their modules are also demonstrated. Furthermore, application studies focused on the electric power supply field such as BTB, SVG and a load leveling system are also introduced.
Keywords
power semiconductor devices; power semiconductor diodes; power semiconductor switches; silicon compounds; wide band gap semiconductors; 12.5 kV; 19.5 kV; BTB; SICGT; SIJFET; SVG; Schottky barrier diode; Si theoretical limit; SiC; SiC FET; SiC SBD; bipolar device; chip size; crystal defect; current capability; electric power supply field; field effect transistor; load leveling system; pn diode; power device development; switching device; Application specific integrated circuits; Bipolar integrated circuits; Motorcycles; Power supplies; Research and development; Schottky diodes; Silicon carbide; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs, 2003. Proceedings. ISPSD '03. 2003 IEEE 15th International Symposium on
Print_ISBN
0-7803-7876-8
Type
conf
DOI
10.1109/ISPSD.2003.1225220
Filename
1225220
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