• DocumentCode
    1951757
  • Title

    Good temperature coefficient of frequency SAW resonator on a SiO2/Al/LiNbO3 structure

  • Author

    Nakanishi, H. ; Nakamura, H. ; Tsurunari, T. ; Fujiwara, J. ; Hamaoka, Y. ; Hashimoto, K.

  • Author_Institution
    Corp. Components Dev. Div., Panasonic Electron. Devices Co. Ltd., Kadoma, Japan
  • fYear
    2010
  • fDate
    11-14 Oct. 2010
  • Firstpage
    1298
  • Lastpage
    1301
  • Abstract
    This paper describes a good temperature coefficient of frequency (TCF) surface acoustic wave (SAW) resonator on a SiO2/Al/LiNbO3 structure. We studied the dependence of TCF and electromechanical coupling factor (K2) of shear-horizontal (SH) SAW on the SiO2 thickness, where the SiO2 shape control technique is applied to suppress spurious responses caused by Rayleigh-mode. As the results, we could realize high performance SAW resonator having moderate K2 (8%) and zero TCF with complete suppression of the Rayleigh-mode spurious response. It was demonstrated that the SiO2 shape control technique is effective for suppression of the Rayleigh-mode spurious response in the SAW resonator using the SiO2/Al/LiNbO3 structure with wide range of SiO2 thicknesses. We also revealed applicability of the SiO2/Al/LiNbO3 structure to SAW duplexers with narrow duplex gap.
  • Keywords
    aluminium; code division multiple access; electromechanical effects; lithium compounds; shape control; silicon compounds; surface acoustic wave resonators; surface acoustic waves; Rayleigh-mode spurious response suppression; SAW duplexer; SiO2-Al-LiNbO3; TCF; electromechanical coupling factor; narrow duplex gap; shape control technique; shear-horizontal SAW; surface acoustic wave resonator; temperature coefficient of frequency SAW resonator; Lithium niobate; Resonant frequency; Shape; Shape control; Surface acoustic waves; Temperature; Rayleigh-mode spurious response; SAW resonator; SiO2 shape control; SiO2/Al/LiNbO3 structure; TCF;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2010 IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4577-0382-9
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2010.5935465
  • Filename
    5935465