• DocumentCode
    1951789
  • Title

    Real-Time Fluid Interaction with a Haptic Device

  • Author

    Mora, Javier ; Lee, Won-Sook

  • Author_Institution
    Ottawa Univ., Ottawa
  • fYear
    2007
  • fDate
    12-14 Oct. 2007
  • Firstpage
    160
  • Lastpage
    165
  • Abstract
    Imagine an interactive video game in which the player impersonates the role of a witch that desires to create a potion. Through a haptic probe, shaped as a baton, users are able to stir and feel the magical fluid inside a bowl. As players follow the potion recipe, they are able to feel how the fluid changes its viscosity, density, velocity and other properties. This haptic interface enables users to interact with the digital world and receive realistic kinesthetic and tactile cues in a computer-generated environment. The novel techniques described on this paper may bring this simulation to a higher degree of human-computer interaction and immersion. We present an experimental framework for assessing haptic effects in stirred fluid simulations. The system imitates the physical forces generated by the real-time fluid animation, stirring movements and fluid changes. We discuss the integration of both the haptics and graphics workspaces for an efficient interaction.
  • Keywords
    computer animation; computer games; haptic interfaces; human computer interaction; computer-generated environment; graphics workspaces; haptic device; haptic effects; haptic interface; haptic probe; human-computer interaction; interactive video game; real-time fluid animation; real-time fluid interaction; realistic kinesthetic cues; stirred fluid simulations; tactile cues; Animation; Application software; Computational modeling; Computer graphics; Force feedback; Games; Haptic interfaces; Real time systems; Rendering (computer graphics); Viscosity; Fluid Simulation; Gaming; Gesture Recognition; Haptic Feedback;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Haptic, Audio and Visual Environments and Games, 2007. HAVE 2007. IEEE International Workshop on
  • Conference_Location
    Ottawa, Ont.
  • Print_ISBN
    978-1-4244-1571-7
  • Electronic_ISBN
    978-1-4244-1571-7
  • Type

    conf

  • DOI
    10.1109/HAVE.2007.4371606
  • Filename
    4371606