• DocumentCode
    1952026
  • Title

    Fluid dynamics analysis of atmospheric thermal silicon oxidation reactors using dispersion models

  • Author

    Philipossian, A. ; Van Wormer, K.

  • Author_Institution
    Digital Equipment Corp., Hudson, MA, USA
  • fYear
    1992
  • fDate
    13-16 Dec. 1992
  • Firstpage
    185
  • Lastpage
    188
  • Abstract
    The Residence Time Distribution (RTD) technique combined with mass spectroscopic Residual Gas Analysis (RGA) is employed, for the first time, to study the nature of nonideal gas flow in atmospheric thermal silicon oxidation reactors. The RTD results are interpreted in terms of various dispersion models. Higher flow rates improve plug flow conditions by reducing the Dispersion Number, D. In cases where baffles are not used upstream of the wafers, the Finite Length System (FLS) model agrees most closely with the experimental data due the presence of macroscopic variations in flow caused by the entering gas jet. When baffles are present, the Semi-Infinite Length System (SILS) model is shown to apply. Increasing the number of baffles and the longitudinal location results in lower D. The trends are explained theoretically by determining the extent of natural convection which has been shown to be the major obstacle towards achieving plug flow conditions in thermal silicon oxidation reactors.<>
  • Keywords
    elemental semiconductors; fluid dynamics; mass spectroscopic chemical analysis; oxidation; semiconductor process modelling; silicon; Si; atmospheric thermal Si oxidation reactors; baffles; dispersion models; finite length system model; fluid dynamics analysis; gas jet; mass spectroscopic residual gas analysis; natural convection; nonideal gas flow; plug flow conditions; residence time distribution; semi-infinite length system model; wafer processing; Chemical analysis; Fluid flow; Mass spectroscopy; Oxidation; Semiconductor process modeling; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1992. IEDM '92. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-0817-4
  • Type

    conf

  • DOI
    10.1109/IEDM.1992.307338
  • Filename
    307338