Thermal improvement of die attach with iodine treatment and its application in solid state lighting

Author

Zhang, Kai ; Zhang, Xinfeng ; Zhang, Min ; Chen Yang ; Sun, Hongye ; Yuen, Michelle ; Zhong, Barry ; Bok, Aernout Reints ; Liu, Lisa ; Chan, Cheuk Yan ; Zhang, Guoqi

Author_Institution

Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China

fYear

2012

fDate

16-18 April 2012

Firstpage

42373

Lastpage

42464

Abstract

The mechanism of thermal conductivity enhancement of silver epoxy based die attach materials (DA) by iodine treatment is studied. Iodine treatment is found to be able to uniform the polymer network and accelerate the curing of die attach at relatively lower temperature with shorter curing duration. In addition, several metal halide salts are proved to have the same effect as the iodine treatment and be able to improve the conductivity of DA. The developed DA is applied in LED packages. The thermal performance of LED packages is evaluated to demonstrate the effect of iodine treatment of DA.

Keywords

curing; electronics packaging; light emitting diodes; lighting; microassembling; LED packages; curing; die attach materials; iodine treatment; metal halide salts; polymer network; silver epoxy; solid state lighting; thermal conductivity enhancement; thermal improvement; Lead; Light emitting diodes; Lighting; Packaging; Polymers; Thermal conductivity; Voltage control;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on

Conference_Location

Cascais

Print_ISBN

978-1-4673-1512-8

Type

conf

DOI

10.1109/ESimE.2012.6191733

Filename

6191733