• DocumentCode
    1952889
  • Title

    A dynamical approach to the complex coefficients of hysteretic responses

  • Author

    Zhang, Keyu ; Wang, Linxiang ; Liu, Rong

  • Author_Institution
    Inst. of Mechatron. Eng., Hangzhou Dianzi Univ., Hangzhou, China
  • Volume
    7
  • fYear
    2010
  • fDate
    9-11 July 2010
  • Firstpage
    173
  • Lastpage
    177
  • Abstract
    To describe the field-dependent hysteretic responses of dielectric materials when the applied electrical loadings beyond small field ranges, the Rayleigh´s law and the complex dielectric constant notation have been introduced with some success. In the current paper, we investigate the field-dependent hysteretic responses on a dynamical point of view. It is shown that the hysteretic responses can be modeled by the Duffing equation, and the field-dependency feature can be naturally captured by the model. The complex dielectric coefficients and the Rayleigh´s law can be regarded as special cases of the dynamical system approach. Numerical comparisons among the three models illustrate that the proposed nonlinear differential model is able to capture more accurately the hysteretic behavior of dielectric materials. It is also much easier to model the dielectric losses that presented in all dielectric materials. In the proposed dynamical approach, the loss tangent and the hysteretic behavior are both influenced by the frequency of the applied external loadings.
  • Keywords
    Rayleigh scattering; dielectric materials; differential equations; Duffing equation; Rayleigh´s law; complex coefficients; complex dielectric constant notation; dielectric coefficients; dielectric materials; electrical loadings; field-dependent hysteretic responses; hysteretic behavior; loss tangent; Analytical models; Annealing; Load modeling; Rayleigh´s law; complex notation; dielectric material; differential equation model; hysteresis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Science and Information Technology (ICCSIT), 2010 3rd IEEE International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4244-5537-9
  • Type

    conf

  • DOI
    10.1109/ICCSIT.2010.5564778
  • Filename
    5564778