DocumentCode
1952898
Title
IC-processed hot-filament vacuum microdevices
Author
Williams, K.R. ; Muller, R.S.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear
1992
fDate
13-16 Dec. 1992
Firstpage
387
Lastpage
390
Abstract
Micromachined vacuum devices that employ a hot tungsten filament as a source of electromagnetic radiation and thermionically emitted electrons have been fabricated. These hot-filament devices have been characterized for use as "microlamps," vacuum diodes, and triodes. Coplanar filaments are used for the cathodes and anodes in the diodes, and also for the grids in the triodes. The filaments are typically 200- mu m long and are suspended over a cavity in the silicon substrate. The devices tested were operated in a pumped vacuum chamber.<>
Keywords
diodes; elemental semiconductors; semiconductor technology; silicon; triodes; vacuum microelectronics; 200 micron; Si; coplanar filaments; hot-filament vacuum microdevices; microlamps; micromachined vacuum devices; pumped vacuum chamber; silicon substrate; thermionically emitted electrons; vacuum diodes; vacuum triodes; Diodes; Electron tubes; Semiconductor device fabrication; Silicon; Vacuum microelectronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1992. IEDM '92. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Print_ISBN
0-7803-0817-4
Type
conf
DOI
10.1109/IEDM.1992.307384
Filename
307384
Link To Document