Title :
Thermal resistance investigations on new leadframe-based LED packages and boards
Author :
Pardo, B. ; Gasse, A. ; Fargeix, A. ; Jakovenko, J. ; Werkhoven, R.J. ; Perpiña, X. ; Van Weelden, T. ; Bancken, P.
Author_Institution :
CEA-Leti, MINATEC Campus, Grenoble, France
Abstract :
In Solid State Lighting, thermal management is a key issue. Within the C-SSL consortium, we have developed an advanced leadframe based package to reduce the thermal resistance of the component. Numerical simulations have been implemented using Ansys® software and thermal measurements have been carried out using the forward voltage method to derive the thermal resistance. The T3ster® transient thermal analysis has been used to determine the different thermal resistance contributions in the package and in the board showing good correlation between experimental and simulation results. Low thermal resistances of 5.5 K/W have been obtained on our advanced leadframe based package and have been compared with standard Rebel LEDs on board.
Keywords :
electronics packaging; light emitting diodes; temperature measurement; thermal management (packaging); thermal resistance; transient analysis; Ansys software; C-SSL consortium; T3ster transient thermal analysis; advanced leadframe based package; forward voltage method; leadframe-based LED boards; leadframe-based LED packages; numerical simulations; solid state lighting; standard Rebel LEDs on board; thermal management; thermal measurements; thermal resistance contributions; thermal resistance investigations; Cooling; Films; Heating; Lead; Nonhomogeneous media; RNA;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location :
Cascais
Print_ISBN :
978-1-4673-1512-8
DOI :
10.1109/ESimE.2012.6191750
