Title :
Inkjet printed electrically conductive structures for microelectronics
Author_Institution :
Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland
Abstract :
Production of modern microelectronic devices and circuits needs technologies with the highest level of packaging process, resolution and repeatability. Ink jet technology with micro-dimensions nozzle is year by year wider used for this purpose. It makes possible to dispense small volumes of a material in the range of tens picolitres. The printing electrically conductive microstructures require dispensed materials containing conductive particles as filler. Such demands are fulfilled by formulations containing silver particles with size dimensions less than 10 nm. Only this type of fluids working very stable during extremely long time and the highest acceleration during printing process. All aspects for this printing technology will be described in this paper as well as properties of conductive filler, inks and printing process phenomenon.
Keywords :
ink jet printing; integrated circuit packaging; nozzles; printing; conductive filler; inkjet printed electrically conductive microstructure; microdimension nozzle; microelectronic circuit; microelectronic device; packaging process; printing process phenomenon; Heating; Ink; Microelectronics; Printing; Resistance; Silver; Temperature measurement;
Conference_Titel :
Electronics Technology (ISSE), 2011 34th International Spring Seminar on
Conference_Location :
Tratanska Lomnica
Print_ISBN :
978-1-4577-2111-3
DOI :
10.1109/ISSE.2011.6053540