• DocumentCode
    1953040
  • Title

    Inkjet printed electrically conductive structures for microelectronics

  • Author

    Felba, Jan

  • Author_Institution
    Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland
  • fYear
    2011
  • fDate
    11-15 May 2011
  • Firstpage
    6
  • Lastpage
    11
  • Abstract
    Production of modern microelectronic devices and circuits needs technologies with the highest level of packaging process, resolution and repeatability. Ink jet technology with micro-dimensions nozzle is year by year wider used for this purpose. It makes possible to dispense small volumes of a material in the range of tens picolitres. The printing electrically conductive microstructures require dispensed materials containing conductive particles as filler. Such demands are fulfilled by formulations containing silver particles with size dimensions less than 10 nm. Only this type of fluids working very stable during extremely long time and the highest acceleration during printing process. All aspects for this printing technology will be described in this paper as well as properties of conductive filler, inks and printing process phenomenon.
  • Keywords
    ink jet printing; integrated circuit packaging; nozzles; printing; conductive filler; inkjet printed electrically conductive microstructure; microdimension nozzle; microelectronic circuit; microelectronic device; packaging process; printing process phenomenon; Heating; Ink; Microelectronics; Printing; Resistance; Silver; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2011 34th International Spring Seminar on
  • Conference_Location
    Tratanska Lomnica
  • ISSN
    2161-2528
  • Print_ISBN
    978-1-4577-2111-3
  • Type

    conf

  • DOI
    10.1109/ISSE.2011.6053540
  • Filename
    6053540