Title :
The design concept of system integration based on heterostructure
Author :
Slosar ík, Stanislav ; Cabúk, Pavol ; Kalita, Wlodzimierz ; Bauer, Reinhard ; Sabat, Wieslaw ; Kardo, Slavomír
Author_Institution :
Dept. of Technol. in Electron., Tech. Univ. of Kosice, Košice, Slovakia
Abstract :
This study shows technological realization of heterostructure LTCC structure - HTCC substrate. Heterostructure realization results are analyzed regarding the application of LTCC ceramics and HTCC substrates where possible solution is local heat dissipation from power elements. Technological solution has been applied during the 3D integrations of mobile mini-machine control electronics in a System on Module (SoM) assembly.
Keywords :
ceramic packaging; cooling; HTCC substrate; LTCC ceramics; SoM assembly; heat dissipation; heterostructure LTCC structure; mobile minimachine control electronics; system on module; Aluminum oxide; Heating; Lamination; Mobile communication; Substrates; Temperature measurement; Three dimensional displays;
Conference_Titel :
Electronics Technology (ISSE), 2011 34th International Spring Seminar on
Conference_Location :
Tratanska Lomnica
Print_ISBN :
978-1-4577-2111-3
DOI :
10.1109/ISSE.2011.6053542
