The mischmetal and Bi94Zn6 effect alloying on SACX 0307

Author

Branzei, Mihai ; Pencea, Ion ; Plotog, I. ; Miculescu, F. ; Cristea, Ionut ; Thumm, Andreas

Author_Institution

CEMS, Univ. Politeh. of Bucharest, Bucharest, Romania

fYear

2013

fDate

8-12 May 2013

Firstpage

24

Lastpage

29

Abstract

According to “4P Soldering Model” (Paste-Pad-Pin-Process) [1], solder paste will be selected from a typically paste solutions determined by solder alloy as basic material, flux and geometry aspects consequences of stencil design. The functions are in direct connection with the solder joint microstructure. The new SACX 0307 solder alloys, inoculated with mischmetal (MM) and Bi₉₄Zn₆ near eutectic alloy, proposal for studies take into considerations the criteria and desired attributes for Lead-Free solder alloy. The results of experiments performed are present, by using SEM/EDS technique. These results will be evaluated in order to obtain a new solder paste for improving process control in VPS lines by minimize the cooling rate effect on solder joint structure. Thus, it can be assure the solder joints reliability by reducing defects numbers and rework time.

Keywords

X-ray chemical analysis; alloying; bismuth alloys; cooling; eutectic alloys; rare earth alloys; reliability; scanning electron microscopy; solders; zinc alloys; 4P soldering model; Bi₉₄Zn₆ alloying effect; Bi₉₄Zn₆ near eutectic alloy; EDS technique; SACX 0307 solder alloys; SEM; SiYLaCePrNdPmDyAmGdBi₉₄Zn₆; VPS lines; cooling rate effect; mischmetal; paste-pad-pin-process model; solder joint microstructure; solder joints reliability; solder paste; stencil design; Bismuth; Grain size; Silicon; Soldering; Tin; Zinc;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology (ISSE), 2013 36th International Spring Seminar on

Conference_Location

Alba Iulia

ISSN

2161-2528

Type

conf

DOI

10.1109/ISSE.2013.6648208

Filename

6648208