• DocumentCode
    1953214
  • Title

    Project management for system-on-chip using multi-chip modules

  • Author

    Dent, Donald J.

  • Author_Institution
    Luton Univ., UK
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    283
  • Lastpage
    290
  • Abstract
    Multi-Chip Module (MCM) projects are complex, in terms of the technology used, and are expensive, typically in excess of $50,000. MCM technology is very unforgiving in that mistakes cannot be easily rectified or the device easily re-worked. The Mosaic Earth Sensor Mutli-Chip Module (MESMCM) project, which was the subject of a case study, was a high speed, first-of-a-kind development that ran into some difficulties in spite of rigorous project management. It is intended to compare the project management structure used for a technology demonstrator with the new structure used on subsequent MCM designs. One of the outcomes of this case study was that the management of an MCM project is just as crucial as the technical aspects and resulted in several guidelines about the nature and composition of the design team. The lessons learned from the MESMCM project were applied very effectively to further MCM designs
  • Keywords
    concurrent engineering; multichip modules; project management; MCM designs; MCM projects; design team; multi-chip modules; project management structure; system-on-chip; technology demonstrator; Design engineering; Earth; Electrical capacitance tomography; Project management; Radio access networks; Read only memory; System-on-a-chip; Technology management; Test equipment; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2000. ISQED 2000. Proceedings. IEEE 2000 First International Symposium on
  • Conference_Location
    San Jose, CA
  • Print_ISBN
    0-7695-0525-2
  • Type

    conf

  • DOI
    10.1109/ISQED.2000.838884
  • Filename
    838884