• DocumentCode
    1953261
  • Title

    3D thermal profiling of an experimental Vapour Phase Soldering Station

  • Author

    Géczy, Attila ; Péter, Zsolt ; Vitéz, Zsolt Illyefalvi

  • Author_Institution
    Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ. (BME-ETT), Budapest, Hungary
  • fYear
    2011
  • fDate
    11-15 May 2011
  • Firstpage
    89
  • Lastpage
    93
  • Abstract
    Three-dimensional (3D) thermal profiling setup was developed for an experimental Vapour Phase Soldering (VPS) station to identify vapour and heat propagation. The VPS process was inspected during the heating up period, considering vapour-mist blanket [1] generation. The effective space used for soldering inside the soldering chamber (above the level of Galden liquid) was profiled using a grid of thermocouples. The grid was constructed on a planar two-dimensional (2D) frame with Type K thermocouples. Instead of a 3D construction planar and symmetric 2D geometry was used to maintain low additional thermal capacitances of the frame. This frame fixed the thermocouples inside the chamber. The planar grid was moved to specific vertical coordinates before each measurement. Parameters of the station (initial liquid temperature, Galden type, Galden volume/mass, heating power) were controlled to achieve uniform processes for each vertical height setting of the 2D plane. Results of 2D profiling at specific heights were then superposed to receive data for a 3D temperature map at a given time point. Additional data was also gathered to expand knowledge of thermal properties inside the experimental station. Data was gathered with ten channel batched data-acquisition. Thermal maps were displayed using Origin software.
  • Keywords
    soldering; thermocouples; vapour phase epitaxial growth; 3D thermal profiling; Galden liquid; data acquisition; heat propagation; planar 2D frame; soldering chamber; ten channel batched; thermal capacitances; thermocouples; vapour phase soldering station; vapour propagation; Heat transfer; Heating; Isothermal processes; Soldering; Temperature distribution; Temperature measurement; Three dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology (ISSE), 2011 34th International Spring Seminar on
  • Conference_Location
    Tratanska Lomnica
  • ISSN
    2161-2528
  • Print_ISBN
    978-1-4577-2111-3
  • Type

    conf

  • DOI
    10.1109/ISSE.2011.6053556
  • Filename
    6053556