Process optimization and characterization of a novel micro-scaled silver sintering paste as a die-attach material for high temperature high power semiconductor devices

In this study, silver sintering is used as a die-attach technique for the high temperature high power semiconductor devices. Process optimization and characterization of a novel micro-scaled silver sintering paste were performed. The metallurgical aspects on the substrate and die-backside were studied and their influence on the sintering process was evaluated. The influence of degrading mechanisms, such as interfacial diffusion and CTE mismatch on packaging process, was studied and improvements were made. The stresses induced by the assembly process were analyzed analytically and by optical investigation techniques such as white light interferometery and electronic speckle pattern interferometery. Silver sintering can be a potential candidate as a die-attachment technique for future high temperature high power semiconductor devices.