DocumentCode
1953300
Title
Experimental and numerical assessment of adhesion in real-life MEMS
Author
Ardito, R. ; Baldasarre, L. ; Corigliano, A. ; De Masi, B. ; Frangi, A. ; Magagnin, L.
Author_Institution
Politec. di Milano, Milan, Italy
fYear
2012
fDate
16-18 April 2012
Firstpage
42375
Lastpage
42527
Abstract
The goal of this research is to measure the adhesion energy in experimental devices which are as alike as possible to real-life MEMS and to provide a sound basis for numerical methods which could predict the adhesion energy in various situations. In this way, a better knowledge of adhesion properties is obtained, possibly entailing deeper miniaturization and higher optimization of microstructures. The paper describes the innovative experimental measurements which have been carried out and the comparison with numerical outcomes via Finite Element Method (FEM).
Keywords
adhesion; finite element analysis; micromechanical devices; MEMS; adhesion energy measurement; adhesion energy prediction; finite element method; microstructure optimization; Computational modeling; Deformable models; Displacement measurement; Face; Micromechanical devices;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location
Cascais
Print_ISBN
978-1-4673-1512-8
Type
conf
DOI
10.1109/ESimE.2012.6191767
Filename
6191767
Link To Document