Title :
System integration: thermal aspects of chip utilization of power devices
Author :
Reimann, T. ; Franke, U. ; Petzoldt, J. ; Krümmer, R. ; Lorenz, L.
Author_Institution :
Dept. of Power Electron., TU Ilmenau, Germany
Abstract :
This paper presents two sides of combined silicon utilization - power device and control chip. For these purpose investigations of the transient chip temperature of a multichip power module are presented. The calculation of chip temperature and power losses occurs on-line in a microcontroller. Advanced practical results achieved in a 3-phase inverter application are shown at different loads. In addition, required controller resources are discussed for the control unit.
Keywords :
microcontrollers; multichip modules; power electronics; reliability; thermal stability; 3-phase inverter; chip temperature; chip utilization; control chip; microcontroller; multichip power module; power devices; power losses; system integration; thermal aspects; Control systems; Impedance; Microcontrollers; Power electronics; Power system transients; Pulse width modulation inverters; Silicon; Temperature; Thermal resistance; Thermal sensors;
Conference_Titel :
Power Semiconductor Devices and ICs, 2003. Proceedings. ISPSD '03. 2003 IEEE 15th International Symposium on
Print_ISBN :
0-7803-7876-8
DOI :
10.1109/ISPSD.2003.1225294
