Climatic resistance of electrically conductive adhesive modified with silver nanoparticles

A part of silver micro-flakes in electrically conductive adhesive based on bis-phenol epoxy matrix was substituted with silver nanoparticles. Formulations with concentrations of 10 %, 20 % and 30 % (by_wt.) of silver nanoballs were prepared. The total concentration of silver in adhesive was 75 % (by_wt.) for every formulation. Adhesive joints of all formulations were formed and aged at the temperature of 120 °C, at the relative humidity of ~100 %, and at the combination temperature/humidity 80 °C/~100 % RH for 700 hours. Joints resistances were measured using a four-point method. It was found that substitution of a part of micro-flakes with nanoparticles do not cause significant change in climatic resistance of adhesive joints.