Investigating copper wire bonding technology in Chip-on-Board applications

Author

Krammer, Oliver ; Roka, Peter ; Jakab, Laszlo

Author_Institution

Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary

fYear

2013

fDate

8-12 May 2013

Firstpage

94

Lastpage

98

Abstract

In our experiment, the possibility of forming copper wire bonds in Chip-on-Board (COB) applications was investigated. In the experiment, such surface finishes were studied and compared which are common in printed circuit board based COB applications and can be bonded with wire bonding technologies. These finishes were immersion silver (ImAg), electroless nickel / immersion gold (ENIG) and electroless nickel / electroless palladium / immersion gold (ENEPIG). On each type of surface finish, copper wires with two diameters (33 and 300 μm) were bonded with a TPT Ultrasonic bonder. The wire bonds then characterized by optical inspections and mechanical measurements which are detailed in the paper.

Keywords

chip-on-board packaging; lead bonding; printed circuit design; surface finishing; COB applications; ENEPIG; TPT ultrasonic bonder; chip-on-board applications; copper wire bonding technology; electroless nickel; electroless palladium; immersion gold; immersion silver; mechanical measurements; optical inspections; printed circuit board; surface finishes; wire bonding technologies; Bonding; Copper; Gold; Optical imaging; Silver; Surface finishing; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology (ISSE), 2013 36th International Spring Seminar on

Conference_Location

Alba Iulia

ISSN

2161-2528

Type

conf

DOI

10.1109/ISSE.2013.6648222

Filename

6648222