DocumentCode :
1953479
Title :
Influence of surface finish on resistance of contacts between ECA and Pad
Author :
Mach, Pavel ; Cinert, Jakub
Author_Institution :
Dept. of Electrotechnol., Czech Tech. Univ. in Prague, Prague, Czech Republic
fYear :
2011
fDate :
11-15 May 2011
Firstpage :
131
Lastpage :
134
Abstract :
Contact resistance between adhesive and pad is examined. Three types of adhesives based on bis-phenol resin matrix filled with silver flakes are studied on copper, nickel and gold surface finishes. The contact resistance is calculated as a difference between result of three terminal and four-terminal measurements. It is found that nickel surface finish is not proper for adhesive assembly, because the contact resistance between this surface finish and adhesive is too high, whereas the contact resistances for copper and gold finishes are comparable, markedly lower than the resistances of adhesive contacts on nickel and acceptable for this type of assembly.
Keywords :
adhesives; contact resistance; copper; gold; nickel; surface finishing; Au; Cu; ECA; Ni; bisphenol resin matrix; contact resistance; electrically conductive adhesives; pad; silver flakes; surface finish; Copper; Current measurement; Electrical resistance measurement; Joints; Surface finishing; Surface resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology (ISSE), 2011 34th International Spring Seminar on
Conference_Location :
Tratanska Lomnica
ISSN :
2161-2528
Print_ISBN :
978-1-4577-2111-3
Type :
conf
DOI :
10.1109/ISSE.2011.6053565
Filename :
6053565
Link To Document :
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