DocumentCode
1953509
Title
Photoimageable details on LTCC ceramic
Author
Markowski, Piotr
Author_Institution
Fac. of Microsyst. Electron. & Photonics, Wroclaw Univ. of Technol., Wroclaw, Poland
fYear
2011
fDate
11-15 May 2011
Firstpage
135
Lastpage
140
Abstract
The researches on fabrication of photoimageable details essential for multilayer electronic circuits design were conducted. Such details as conducting paths and electrical pads were fabricated onto unfired LTCC tapes. The shrinkage of such structures during firing process were investigated as well as some electrical parameters. Moreover, vias indispensable for the multilayer interconnections were performed and filled with the conductive ink using two different techniques.
Keywords
ceramic packaging; LTCC ceramic; conductive ink; electrical pads; electrical parameters; firing process; multilayer electronic circuits design; photoimageable details; unfired LTCC tapes; Ceramics; Fabrication; Filling; Firing; Ink; Springs; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology (ISSE), 2011 34th International Spring Seminar on
Conference_Location
Tratanska Lomnica
ISSN
2161-2528
Print_ISBN
978-1-4577-2111-3
Type
conf
DOI
10.1109/ISSE.2011.6053566
Filename
6053566
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