• DocumentCode
    1953607
  • Title

    Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module

  • Author

    Farley, D.M. ; Boschman, F. ; Bullema, J.E. ; Gielen, A.W.J. ; Hesen, P. ; Krugers, J.P.H.M. ; Swartjes, F. ; van Zeijl, H. ; Zhang, G.Q.

  • fYear
    2012
  • fDate
    16-18 April 2012
  • Firstpage
    42372
  • Lastpage
    42432
  • Abstract
    The reliability assessment aspect of the LED field is not fully developed. The lack of complete understanding is due, in part, to the newness of the field. SSL has not existed long enough to directly gauge the accuracy of the Lifetime Assessments being made. The approach of using simulation in qualification to Lifetime Assessment is one of the major techniques used in the electronics field, in general. This methodology uses a complex approach of characterization, testing, and mathematical simulation to produce what some say is the best route for electronics reliability assessment. At present, literature surveys produce only a few papers implementing any simulation approach to SSL technology reliability assessment.
  • Keywords
    light emitting diodes; lighting; semiconductor device reliability; system-in-package; LED field; SSL module; SSL technology reliability assessment; SiP; electronics field; electronics reliability assessment; lifetime assessments; reliability assessment aspect; solid state lighting module; system-in-package; Analytical models; Lead; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
  • Conference_Location
    Cascais
  • Print_ISBN
    978-1-4673-1512-8
  • Type

    conf

  • DOI
    10.1109/ESimE.2012.6191780
  • Filename
    6191780