Detection of printed circuit board failures based on signal frequency analyses

Author

Blecha, Tomáa

Author_Institution

Dept. of Technol. & Meas., Univ. of West Bohemia in Pilsen, Pilsen, Czech Republic

fYear

2011

fDate

11-15 May 2011

Firstpage

168

Lastpage

171

Abstract

The inspections of printed circuit boards are necessary carry out because of failures and defects detection. Cracks and change of conductive path width are included to the most frequently defects on printed circuits board where are difficulty detected. These defects can cause change of transmission signal integrity thereby it is necessary their detection. New method for detection of these defects was designed. This method is based on measurement of scattering parameters or spectrum of transmission signal. By evaluation of measurement values the failures and defects can be detected. The results obtained by scattering parameters measuring on conductive path with cracks are presented.

Keywords

cracks; failure analysis; inspection; printed circuit manufacture; conductive path width; cracks; defect detection; inspections; printed circuit board failure detection; scattering parameters; signal frequency analyses; Attenuation; Microstrip; Printed circuits; Reflection; Scattering parameters; Springs; Transmission line measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology (ISSE), 2011 34th International Spring Seminar on

Conference_Location

Tratanska Lomnica

ISSN

2161-2528

Print_ISBN

978-1-4577-2111-3

Type

conf

DOI

10.1109/ISSE.2011.6053571

Filename

6053571