Title :
Investigating micro-alloyed solder joints with electrochemical etching
Author :
Garami, Tamas ; Krammer, Oliver
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
Abstract :
In this paper micro-alloyed solders were investigated with a new technique of electrochemical material removal. The samples were soldered with low silver content and micro-alloyed solders and with SAC305 and SAC405. We could investigate the surface of the intermetallic layer by etching the tin based layer from the top of the intermetallic layer. From cross-sections, we also obtained data indicating that what kind of microstructure formed after the reflow process in the solder joints. We measured the thickness of the Cu6Sn5 intermetallic layer in each solder joints. After the etching process, we detected that the shapes of the formed Cu6Sn5 intermetallic layer were different in each samples.
Keywords :
copper alloys; electrochemistry; etching; reflow soldering; silver alloys; solders; tin alloys; Cu6Sn5; SAC305; SAC405; electrochemical etching; electrochemical material removal; etching process; intermetallic layer; microalloyed solder joints; reflow process; silver content; tin based layer; Etching; Intermetallic; Reflow soldering; Tin;
Conference_Titel :
Electronics Technology (ISSE), 2013 36th International Spring Seminar on
Conference_Location :
Alba Iulia
DOI :
10.1109/ISSE.2013.6648235