DocumentCode :
1953775
Title :
Investigating micro-alloyed solder joints with electrochemical etching
Author :
Garami, Tamas ; Krammer, Oliver
Author_Institution :
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Budapest, Hungary
fYear :
2013
fDate :
8-12 May 2013
Firstpage :
161
Lastpage :
166
Abstract :
In this paper micro-alloyed solders were investigated with a new technique of electrochemical material removal. The samples were soldered with low silver content and micro-alloyed solders and with SAC305 and SAC405. We could investigate the surface of the intermetallic layer by etching the tin based layer from the top of the intermetallic layer. From cross-sections, we also obtained data indicating that what kind of microstructure formed after the reflow process in the solder joints. We measured the thickness of the Cu6Sn5 intermetallic layer in each solder joints. After the etching process, we detected that the shapes of the formed Cu6Sn5 intermetallic layer were different in each samples.
Keywords :
copper alloys; electrochemistry; etching; reflow soldering; silver alloys; solders; tin alloys; Cu6Sn5; SAC305; SAC405; electrochemical etching; electrochemical material removal; etching process; intermetallic layer; microalloyed solder joints; reflow process; silver content; tin based layer; Etching; Intermetallic; Reflow soldering; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Technology (ISSE), 2013 36th International Spring Seminar on
Conference_Location :
Alba Iulia
ISSN :
2161-2528
Type :
conf
DOI :
10.1109/ISSE.2013.6648235
Filename :
6648235
Link To Document :
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