• DocumentCode
    1953884
  • Title

    Determination of interface fracture parameters by shear testing using different theoretical approaches

  • Author

    Dudek, R. ; Brämer, B. ; Auersperg, J. ; Pufall, R. ; Walter, H. ; Seiler, B. ; Wunderle, B.

  • Author_Institution
    Micro Mater. Center Chemnitz, Fraunhofer ENAS, Chemnitz, Germany
  • fYear
    2012
  • fDate
    16-18 April 2012
  • Firstpage
    42379
  • Lastpage
    42653
  • Abstract
    Simple adhesion tests like the pull-out test or the button shear tests have been used in industry for decades. They offer a great potential for comparison of different molding compounds, encapsulants, or adhesives on different types of sub-strates with or without surface treatment. However, for theoretical prediction purposes, interface fracture mechanics parameters are needed. Quantitative evaluations of the test applied to molding compound (MC)-button on Cu-leadframe by different fracture- and damage mechanical approaches are the subjects of the paper. Defect tolerant methodologies like the “virtual crack closure technique” (VCCT), which consider the interface initially delaminated, are compared to the damage methodology “cohesive zone modelling (CZM)”, which needs no initial crack and can track the delamination progress. Calculated fracture parameters, in particular the energy release rates and mode mixity are compared. Effects on these parameters are discussed for different button shapes. In-situ tracking of delamination progress for a cubic button is shown using the optical correlation technique microDAC.
  • Keywords
    cracks; delamination; fracture; fracture mechanics; adhesives; button shear test; cohesive zone modelling; cubic button; defect tolerant methodology; delamination progress; encapsulants; initial crack; interface fracture mechanics; interface fracture parameter; mode mixity; molding compound; optical correlation technique microDAC; pull-out test; shear testing; simple adhesion test; substrates; surface treatment; virtual crack closure technique; Creep; Integrated optics; Lead;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
  • Conference_Location
    Cascais
  • Print_ISBN
    978-1-4673-1512-8
  • Type

    conf

  • DOI
    10.1109/ESimE.2012.6191793
  • Filename
    6191793