Title :
Nonlinear analyses of semi-embedded through-silicon via (TSV) interposer with stress relief gap under thermal operating and environmental conditions
Author :
Lau, John H. ; Wu, Shang-Tsai ; Chien, Heng-Chieh
Author_Institution :
Electron. & Optoelectron. Res. Lab., Ind. Technol. Res. Inst. (ITRI), Hsinchu, Taiwan
Abstract :
In this study, 3D IC integrations with a semi-embedded TSV interposer with stress relief gap under thermal operating and environmental conditions are investigated. Emphasis is placed on the determination of the TSV interposer warpage and the nonlinear stress and creep strain in the Al/Cu-low-k pads and micro solder joints.
Keywords :
solders; three-dimensional integrated circuits; 3D IC integrations; TSV interposer; environmental conditions; micro solder joints; nonlinear analyses; semi-embedded through-silicon via; stress relief gap; thermal operating conditions; Conductivity; Copper; Load modeling; Reliability; Temperature dependence; Thermal conductivity; Through-silicon vias;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location :
Cascais
Print_ISBN :
978-1-4673-1512-8
DOI :
10.1109/ESimE.2012.6191796
