Title :
Mechanical and tribological characterizations for reliability design of micromembranes
Author :
Pustan, Marius ; Birleanu, Corina ; Dudescu, Cristian ; Belcin, Ovidiu
Author_Institution :
Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
Abstract :
This paper presents the study of mechanical and tribological behavior of micromembranes supported by serpentine hinges used in optical and communication applications. Micromembranes with different geometrical configurations, supported by two and four hinges are investigated in order to determine their static response under mechanical loadings. The micromembranes stiffness was experimentally investigated using an atomic force microscope. Widely used in micro-switches, these micromembranes are deflected until substrate to close a circuit and transmit a signal. The main failure causes of micromembranes which are directly deflected to substrate are the excessive stress in hinges and stiction. Simulation of the micromembranes mechanical behavior is important for performance optimization and to improve their reliability design. Numerical simulation of micromembranes is presented in paper to estimate the stress distribution in hinges and its maximum value. The geometrical dimensions of hinges have influence on the micromembrane´s mechanical response and on stiction. The adhesive force between micromembrane and substrate depends on the mechanical restorative force given by the hinges stiffness.
Keywords :
adhesives; atomic force microscopy; elasticity; failure analysis; force; geometry; hinges; membranes; microswitches; semiconductor device reliability; stiction; stress analysis; adhesive force; atomic force microscope; communication application; failure causes; geometrical configuration; geometrical dimension; hinge stiffness; mechanical behavior; mechanical characterization; mechanical loading; mechanical response; mechanical restorative force; micromembranes stiffness; microswitches; numerical simulation; optical application; performance optimization; reliability design; serpentine hinges; static response; stiction; stress distribution; tribological behavior; tribological characterization; Fasteners; Loading; Materials; Micromechanical devices; Reliability theory; Switches;
Conference_Titel :
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2012 13th International Conference on
Conference_Location :
Cascais
Print_ISBN :
978-1-4673-1512-8
DOI :
10.1109/ESimE.2012.6191802