Temperature compensated field bus sensor interface for applications in process engineering

Author

Suthau, Eike ; Hildebrandt, S. ; Wolter, Klaus-Jurgen

Author_Institution

Electron. Packaging Lab., Tech. Univ. Dresden, Dresden, Germany

fYear

2013

fDate

8-12 May 2013

Firstpage

365

Lastpage

371

Abstract

A robust, high precision sensor interface (SI) for in-situ temperature measurements in process engineering is presented. Wiring and interference are minimized by directly connecting thick film technology based sensing elements (SEs) to the interface PCB. Fully digital calibration, operating temperature compensation and noise canceling are demonstrated. A low-noise supply scheme for a wide range of operating voltages is examined. Parallel operation of up to 120 units on a self-managing CAN field bus is discussed. The protocol for the sensor interface´s user-friendly generic serial ACM USB connection is illustrated.

Keywords

compensation; controller area networks; field buses; protocols; sensors; temperature control; controller area networks; film technology based sensing elements; fully digital calibration; generic serial ACM USB connection; in-situ temperature measurements; interface PCB; low-noise supply scheme; noise canceling; operating temperature compensation; process engineering; self-managing CAN field bus; temperature compensated field bus sensor interface; Calibration; Noise; Silicon; Temperature distribution; Temperature measurement; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology (ISSE), 2013 36th International Spring Seminar on

Conference_Location

Alba Iulia

ISSN

2161-2528

Type

conf

DOI

10.1109/ISSE.2013.6648274

Filename

6648274