DocumentCode
1954901
Title
A study on temperature-compensated hybrid substrates for surface acoustic wave filters
Author
Kobayashi, H. ; Tohyama, K. ; Hori, Y. ; Iwasaki, Y. ; Suzuki, K.
Author_Institution
NGK Insulators Ltd., Nagoya, Japan
fYear
2010
fDate
11-14 Oct. 2010
Firstpage
637
Lastpage
640
Abstract
A hybrid substrate, comprising a thin LiTaO3 layer bonded to a low-coefficient-of-thermal-expansion support, can be used instead of a conventional LiTaO3 bulk substrate to improve the temperature coefficient of frequency (TCF) of surface acoustic wave (SAW) devices. The use of a thinner LiTaO3 layer will clearly reduce the TCF, but on the other hand, will also lead to large spurious responses in the filter characteristics. However, we report here that if the bottom of the LiTaO3 layer is made sufficiently rough, the problem can be effectively mitigated. In addition, numerical calculations indicate that correct choice of the support material can further mitigate the spurious response. We found that glass was superior to silicon as the support material. A SAW filter comprising a rough-bottom LiTaO3 layer only six-wavelengths thick bonded to a glass substrate exhibited spurious responses of just 0.5 dB, which is comparable to that obtained with a conventional LiTaO3 bulk substrate. Thus, the combination of an appropriate substrate material and a rough-bottomed LiTaO3 layer affords a SAW filter with small TCF and yet good response characteristics.
Keywords
surface acoustic wave filters; thermal expansion; low-coefficient-of-thermal-expansion support; surface acoustic wave devices; surface acoustic wave filters; temperature coefficient of frequency; temperature-compensated hybrid substrates; Glass; Silicon; Substrates; Surface acoustic waves; Temperature; Bulk wave; Hybrid substrate; SAW; Si; TCF; Temperature compensation; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2010 IEEE
Conference_Location
San Diego, CA
ISSN
1948-5719
Print_ISBN
978-1-4577-0382-9
Type
conf
DOI
10.1109/ULTSYM.2010.5935606
Filename
5935606
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