DocumentCode :
1954901
Title :
A study on temperature-compensated hybrid substrates for surface acoustic wave filters
Author :
Kobayashi, H. ; Tohyama, K. ; Hori, Y. ; Iwasaki, Y. ; Suzuki, K.
Author_Institution :
NGK Insulators Ltd., Nagoya, Japan
fYear :
2010
fDate :
11-14 Oct. 2010
Firstpage :
637
Lastpage :
640
Abstract :
A hybrid substrate, comprising a thin LiTaO3 layer bonded to a low-coefficient-of-thermal-expansion support, can be used instead of a conventional LiTaO3 bulk substrate to improve the temperature coefficient of frequency (TCF) of surface acoustic wave (SAW) devices. The use of a thinner LiTaO3 layer will clearly reduce the TCF, but on the other hand, will also lead to large spurious responses in the filter characteristics. However, we report here that if the bottom of the LiTaO3 layer is made sufficiently rough, the problem can be effectively mitigated. In addition, numerical calculations indicate that correct choice of the support material can further mitigate the spurious response. We found that glass was superior to silicon as the support material. A SAW filter comprising a rough-bottom LiTaO3 layer only six-wavelengths thick bonded to a glass substrate exhibited spurious responses of just 0.5 dB, which is comparable to that obtained with a conventional LiTaO3 bulk substrate. Thus, the combination of an appropriate substrate material and a rough-bottomed LiTaO3 layer affords a SAW filter with small TCF and yet good response characteristics.
Keywords :
surface acoustic wave filters; thermal expansion; low-coefficient-of-thermal-expansion support; surface acoustic wave devices; surface acoustic wave filters; temperature coefficient of frequency; temperature-compensated hybrid substrates; Glass; Silicon; Substrates; Surface acoustic waves; Temperature; Bulk wave; Hybrid substrate; SAW; Si; TCF; Temperature compensation; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium (IUS), 2010 IEEE
Conference_Location :
San Diego, CA
ISSN :
1948-5719
Print_ISBN :
978-1-4577-0382-9
Type :
conf
DOI :
10.1109/ULTSYM.2010.5935606
Filename :
5935606
Link To Document :
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