• DocumentCode
    1955328
  • Title

    Micro solid state silicon plate wind velocity sensor

  • Author

    Du, Lidong ; Zhao, Zhan ; Pang, Cheng ; Fang, Zhen ; Liu, Yonghong ; Han, Youjun

  • Author_Institution
    State Key Lab. of Transducer Technol., Chinese Acad. of Sci., Beijing
  • fYear
    2009
  • fDate
    5-8 Jan. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A wind velocity sensor using the torque of cantilever to measure the velocity of wind is presented in this paper. It consists of a thin silicon plate and two short cantilevers which connect with the plate and silicon substrate and will bend when wind blow to the plate. The wind velocity is obtained by measuring the strain caused by the deflection of the cantilevers. The designed sensor was simulated with ANSYS software using the model solid92 and analyzed with fluid mechanics principle and material mechanics principle. It is fabricated using MEMS surface and body micromachining process. By testing the designed sensor within small wind tunnel the results of calculation and simulation are validated. When the input voltage is 0.5 V we obtain a sensor capable of high sensitivity 60 muv/(m/s) at the high wind velocity.
  • Keywords
    atmospheric techniques; cantilevers; elemental semiconductors; finite element analysis; micromachining; microsensors; silicon; strain measurement; velocity measurement; wind; ANSYS software; MEMS surface; Si; body micromachining process; cantilever deflection; cantilever torque; fluid mechanics; material mechanics; microsensor; model solid92; solid state silicon plate sensor; strain measurement; voltage 0.5 V; wind tunnel; wind velocity measurement; wind velocity sensor; Analytical models; Micromachining; Micromechanical devices; Silicon; Solid modeling; Solid state circuits; Strain measurement; Torque measurement; Velocity measurement; Wind speed; Drag force; Platinum resistance; Silicon plate; Wind velocity sensor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4244-4629-2
  • Electronic_ISBN
    978-1-4244-4630-8
  • Type

    conf

  • DOI
    10.1109/NEMS.2009.5068513
  • Filename
    5068513