Industrial design of a solid-state wind sensor

Author

Makinwa, K.A.A. ; Huijsing, J.H. ; Hagedoorn, A.

Author_Institution

Delft Univ. of Technol., Netherlands

fYear

2001

fDate

2001

Firstpage

68

Lastpage

71

Abstract

This paper describes the industrial realization of a solid-state wind sensor, that is one without moving parts. The sensor´s key component is a heated silicon chip that is nonuniformly cooled by the wind. The resulting flow-induced temperature gradient in the chip is measured by integrated thermopiles. Their output is digitized and processed by a microprocessor in order to determine wind speed and direction. For wind speeds between 0.1 and 25 m/s, the errors in the computed wind speed and direction are less than 0.5 m/s (or ±3%) and ±3° respectively

Keywords

computerised instrumentation; electric sensing devices; elemental semiconductors; flow measurement; packaging; silicon; thermopiles; velocity measurement; wind; 0.1 to 2.5 m/s; Si; Si heated chip; errors; flow-induced temperature gradient; integrated thermopiles; microprocessor; packaging; solid state wind sensor; wind direction; wind speed; Acoustic measurements; Packaging; Semiconductor device measurement; Sensor phenomena and characterization; Silicon; Solid state circuits; Temperature sensors; Thermal sensors; Velocity measurement; Wind speed;

fLanguage

English

Publisher

ieee

Conference_Titel

Sensors for Industry, 2001. Proceedings of the First ISA/IEEE Conference

Conference_Location

Rosemont, IL

Print_ISBN

0-7803-6659-X

Type

conf

DOI

10.1109/SFICON.2001.968501

Filename

968501