Title :
SOI as a mainstream IC technology
Author :
Adan, A.O. ; Naka, T. ; Kagisawa, A. ; Shimizu, H.
Author_Institution :
VLSI Dev. Labs., Sharp Corp., Nara, Japan
Abstract :
Silicon on insulator (SOI) based devices have been a research theme for about two decades. The advantages over bulk Si are clear and SOI substrates have been expected to break into the mainstream CMOS IC industry. Until now, these expectations have not been realized. The reasons behind this include: (i) SOI wafer availability, quality and cost; (ii) SOI MOSFET floating body effects and lower breakdown voltage; and (iii) economic reasons that propel bulk CMOS advances in circuit techniques and process technology. This situation is now changing. Battery operated portable devices are called to perform advanced functions that include communication in the RF spectrum at frequencies in the 400 MHz to 2.5 GHz range, as well as complex signal and graphic processing. The low voltage, low power and high performance requirements are showing the limitations of bulk CMOS and are opening a new opportunity for SOI. In this paper, the status of SOI device applications and manufacturing considerations are reviewed.
Keywords :
CMOS integrated circuits; MOSFET; electric breakdown; integrated circuit technology; silicon-on-insulator; 400 MHz to 2.5 GHz; CMOS IC industry; IC economics; IC technology; RF communication; RF spectrum; SOI; SOI MOSFET breakdown voltage; SOI MOSFET floating body effects; SOI based devices; SOI device applications; SOI manufacturing considerations; SOI substrates; SOI wafer availability; SOI wafer cost; SOI wafer quality; Si-SiO/sub 2/; battery operated portable devices; bulk CMOS; bulk CMOS circuit techniques; bulk CMOS process technology; bulk Si substrates; graphic processing; performance requirements; power requirements; signal processing; silicon on insulator based devices; voltage requirements; Availability; Batteries; CMOS integrated circuits; CMOS process; CMOS technology; Costs; MOSFET circuits; Power generation economics; Propulsion; Silicon on insulator technology;
Conference_Titel :
SOI Conference, 1998. Proceedings., 1998 IEEE International
Conference_Location :
Stuart, FL, USA
Print_ISBN :
0-7803-4500-2
DOI :
10.1109/SOI.1998.723073