• DocumentCode
    1955983
  • Title

    SOI technology for high-temperature applications

  • Author

    Francis, P. ; Terao, A. ; Gentinne, B. ; Flandre, D. ; Colinge, J.-P.

  • Author_Institution
    Lab. de Microelectron., Univ. Catholique de Louvain, Belgium
  • fYear
    1992
  • fDate
    13-16 Dec. 1992
  • Firstpage
    353
  • Lastpage
    356
  • Abstract
    This work investigates and demonstrates the potential of Silicon-On-Insulator (SOI) MOSFETs for high-temperature analog and digital applications. The small area of junctions in SOI/MOS devices reduces the high-temperature leakage currents by as much as 3 to 4 orders of magnitude over regular (bulk) MOS devices. The threshold voltage variation with temperature is 2 to 3 times smaller than in bulk devices, and the output conductance of SOI MOSFETs actually improves as temperature is increased. These properties enable the fabrication of digital and analog SOI/CMOS circuits operating up to over 300 degrees C with little performance degradation. This paper describes the high-temperature performances of small SOI/CMOS circuit blocks such as static and dynamic logic gates, frequency dividers, and operational amplifiers.<>
  • Keywords
    CMOS integrated circuits; frequency dividers; high-temperature techniques; integrated circuit technology; integrated logic circuits; operational amplifiers; semiconductor technology; semiconductor-insulator boundaries; MOSFET; SOI technology; SOI/MOS devices; analog applications; digital applications; dynamic logic gates; frequency dividers; high-temperature applications; high-temperature leakage; high-temperature performance; operational amplifiers; output conductance; static logic gates; threshold voltage variation; CMOS integrated circuits; Frequency conversion; High-temperature techniques; Integrated circuit fabrication; Operational amplifiers; Semiconductor device fabrication; Semiconductor-insulator interfaces;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1992. IEDM '92. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Print_ISBN
    0-7803-0817-4
  • Type

    conf

  • DOI
    10.1109/IEDM.1992.307590
  • Filename
    307590