DocumentCode :
1955983
Title :
SOI technology for high-temperature applications
Author :
Francis, P. ; Terao, A. ; Gentinne, B. ; Flandre, D. ; Colinge, J.-P.
Author_Institution :
Lab. de Microelectron., Univ. Catholique de Louvain, Belgium
fYear :
1992
fDate :
13-16 Dec. 1992
Firstpage :
353
Lastpage :
356
Abstract :
This work investigates and demonstrates the potential of Silicon-On-Insulator (SOI) MOSFETs for high-temperature analog and digital applications. The small area of junctions in SOI/MOS devices reduces the high-temperature leakage currents by as much as 3 to 4 orders of magnitude over regular (bulk) MOS devices. The threshold voltage variation with temperature is 2 to 3 times smaller than in bulk devices, and the output conductance of SOI MOSFETs actually improves as temperature is increased. These properties enable the fabrication of digital and analog SOI/CMOS circuits operating up to over 300 degrees C with little performance degradation. This paper describes the high-temperature performances of small SOI/CMOS circuit blocks such as static and dynamic logic gates, frequency dividers, and operational amplifiers.<>
Keywords :
CMOS integrated circuits; frequency dividers; high-temperature techniques; integrated circuit technology; integrated logic circuits; operational amplifiers; semiconductor technology; semiconductor-insulator boundaries; MOSFET; SOI technology; SOI/MOS devices; analog applications; digital applications; dynamic logic gates; frequency dividers; high-temperature applications; high-temperature leakage; high-temperature performance; operational amplifiers; output conductance; static logic gates; threshold voltage variation; CMOS integrated circuits; Frequency conversion; High-temperature techniques; Integrated circuit fabrication; Operational amplifiers; Semiconductor device fabrication; Semiconductor-insulator interfaces;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1992. IEDM '92. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-0817-4
Type :
conf
DOI :
10.1109/IEDM.1992.307590
Filename :
307590
Link To Document :
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