Title :
Reliability of laser diode modules in temperature-uncontrolled environment
Author :
Ciappa, Mauro ; Malberti, Paolo
Author_Institution :
Reliability Lab., Swiss Federal Inst. of Technol., Zurich, Switzerland
Abstract :
An extensive thermal-cycling program of InP laser diode modules, in cylindrical package with fiber pig-tail, from two different manufacturers has been performed in order to evaluate their reliability. Experimental results are presented, the main failure mechanisms are identified, and a simple life-time model is proposed. Using this model, the number of cycles to failure under different thermal stress conditions may be computed.<>
Keywords :
III-V semiconductors; indium compounds; life testing; reliability; semiconductor lasers; thermal stresses; InP; cylindrical package; failure mechanisms; fiber pig-tail; laser diode modules; life-time model; reliability; temperature-uncontrolled environment; thermal stress conditions; thermal-cycling program; Diode lasers; Electronic packaging thermal management; Failure analysis; Lenses; Manufacturing; Silicon; Temperature; Testing; Thermal stresses; Tin;
Conference_Titel :
Reliability Physics Symposium, 1994. 32nd Annual Proceedings., IEEE International
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-1357-7
DOI :
10.1109/RELPHY.1994.307798
