Thermomechanical reliability assessment in SM- and COB-technology by combined experimental and finite element method

Author

Dudek, R. ; Michel, V.B.

Author_Institution

Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany

fYear

1994

fDate

11-14 April 1994

Firstpage

458

Lastpage

465

Abstract

In the paper, the authors address the issue of thermo-mechanically stressed microelectronic assemblies. An approach combining finite element simulation and advanced in-situ measuring techniques are presented. Examples given in the text illustrate the application of the experimental methods such as micro moire technique, speckle pattern photography or X-ray stress analysis in connection with numerical simulations. Finally, actual results concerning solder joint reliability are discussed.<>

Keywords

X-ray analysis; circuit reliability; finite element analysis; moire fringes; photographic applications; soldering; surface mount technology; COB-technology; SM-technology; X-ray stress analysis; finite element method; in-situ measuring techniques; micro moire technique; microelectronic assemblies; solder joint reliability; speckle pattern photography; thermomechanical reliability assessment; Assembly; Finite element methods; Microelectronics; Numerical simulation; Pattern analysis; Photography; Soldering; Speckle; Thermal stresses; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1994. 32nd Annual Proceedings., IEEE International

Conference_Location

San Jose, CA, USA

Print_ISBN

0-7803-1357-7

Type

conf

DOI

10.1109/RELPHY.1994.307799

Filename

307799