Title :
Thermomechanical reliability assessment in SM- and COB-technology by combined experimental and finite element method
Author :
Dudek, R. ; Michel, V.B.
Author_Institution :
Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
Abstract :
In the paper, the authors address the issue of thermo-mechanically stressed microelectronic assemblies. An approach combining finite element simulation and advanced in-situ measuring techniques are presented. Examples given in the text illustrate the application of the experimental methods such as micro moire technique, speckle pattern photography or X-ray stress analysis in connection with numerical simulations. Finally, actual results concerning solder joint reliability are discussed.<>
Keywords :
X-ray analysis; circuit reliability; finite element analysis; moire fringes; photographic applications; soldering; surface mount technology; COB-technology; SM-technology; X-ray stress analysis; finite element method; in-situ measuring techniques; micro moire technique; microelectronic assemblies; solder joint reliability; speckle pattern photography; thermomechanical reliability assessment; Assembly; Finite element methods; Microelectronics; Numerical simulation; Pattern analysis; Photography; Soldering; Speckle; Thermal stresses; Thermomechanical processes;
Conference_Titel :
Reliability Physics Symposium, 1994. 32nd Annual Proceedings., IEEE International
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-1357-7
DOI :
10.1109/RELPHY.1994.307799
