Electro-thermal circuit simulation of analog controlled power circuitry

Author

Digele, G. ; Lindenkreuz, S. ; Kasper, E.

Author_Institution

Robert Bosch GmbH, Reutlingen, Germany

fYear

1998

fDate

27-29 Apr 1998

Firstpage

137

Lastpage

142

Abstract

We present circuit simulation by considering self-heating of and electro-thermal interaction between the devices. The heat diffusion equation is solved in the silicon die, adhesive layer and header. Thermal compact models represent heat propagation through power packages. The power of this approach is illustrated by an industrial application

Keywords

adhesives; analogue integrated circuits; circuit simulation; electric current control; heating; integrated circuit packaging; power integrated circuits; thermal analysis; thermal management (packaging); Si; adhesive layer; analog controlled power circuitry; circuit simulation; electro-thermal circuit simulation; electro-thermal interaction; header; heat diffusion equation; heat propagation; industrial application; power packages; self-heating; silicon die; thermal compact models; Automotive engineering; Circuit simulation; Electronic packaging thermal management; Heating; Mirrors; Nonlinear equations; Silicon; Temperature; Thermal conductivity; Thermal expansion;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1998. IEMT-Europe 1998. Twenty-Second IEEE/CPMT International

Conference_Location

Berlin

Print_ISBN

0-7803-4520-7

Type

conf

DOI

10.1109/IEMTE.1998.723075

Filename

723075