DocumentCode :
1956137
Title :
Professional Program Proceedings. Electronic Industries Forum of New England
fYear :
1997
fDate :
6-8 May 1997
Abstract :
The following topics were dealt with: product development; shielding; heat sinks; wireless telecommunications; switching networks; concurrent engineering; packaging; EMC; SMT; ESD; RF power amplifiers; and ATM networks
Keywords :
asynchronous transfer mode; concurrent engineering; electromagnetic compatibility; electrostatic discharge; heat sinks; mobile communication; packaging; power amplifiers; product development; radiofrequency amplifiers; shielding; surface mount technology; switching networks; ATM networks; EMC; ESD; RF power amplifiers; SMT; concurrent engineering; heat sinks; packaging; product development; shielding; switching networks; wireless telecommunications;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Industries Forum of New England, 1997. Professional Program Proceedings
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-3987-8
Type :
conf
DOI :
10.1109/EIF.1997.605369
Filename :
605369
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1956137
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