• DocumentCode
    1956947
  • Title

    Single electrode periodic buried IDT analysis using an original FEM/BEM numerical model

  • Author

    Ventura, Pascal ; Hecht, Frédéric ; Dufilié, Pierre

  • Author_Institution
    PV R&D Consulting, Nice, France
  • fYear
    2010
  • fDate
    11-14 Oct. 2010
  • Firstpage
    645
  • Lastpage
    649
  • Abstract
    The use of buried electrodes in SAW designs on quartz has important advantages when compared with unburied metal electrodes on the surface. One important property is the suppression of waveguide modes in transducers. A second advantage is the ability to use thicker metal thereby reducing the resistive losses. A numerical model for the buried electrodes is a useful tool for optimizing the buried electrode geometry. The numerical model can be extended to include the case of raised electrodes where a given depth of non-metalized substrate has been removed by reactive ion etch (RIE). This paper describes a new numerical model that is used to simulate the electro-acoustical behavior of a single periodic buried (or partially buried) IDT. In order to take into account the buried part of the electrode, it is necessary to include in the FEM domain the buried electrode along with part of the piezoelectric substrate, and of the dielectric domain above the electrode. The dielectric and the piezoelectric semi-spaces are taken into account with boundary integral formulations while Bloch Floquet´s conditions are expressed on the lateral boundaries using an original and efficient method. P matrix parameters for a single periodic buried IDT will be shown, as well as comparisons with buried IDT experimental data.
  • Keywords
    acoustoelectric effects; boundary-elements methods; finite element analysis; interdigital transducers; surface acoustic wave devices; Bloch Floquet´s conditions; FEM/BEM numerical model; SAW designs; boundary integral formulations; buried electrode geometry; dielectric domain; electro-acoustical behavior; periodic buried IDT analysis; piezoelectric semispaces; piezoelectric substrate; quartz; reactive ion etch; single electrode; thicker metal; unburied metal electrodes; waveguide modes; Boundary conditions; Dielectrics; Electrodes; Finite element methods; Numerical models; Surface acoustic waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2010 IEEE
  • Conference_Location
    San Diego, CA
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4577-0382-9
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2010.5935694
  • Filename
    5935694