• DocumentCode
    1956978
  • Title

    Thermal analysis software picks optimum heat sink design

  • Author

    Chapman, Christopher L.

  • Author_Institution
    Dept. of Comput. Ind., Aavid Thermal Technol. Inc., USA
  • fYear
    1997
  • fDate
    6-8 May 1997
  • Firstpage
    37
  • Lastpage
    42
  • Abstract
    Though seemingly simple, heat sinks are complex designs that balance at least eight variables to achieve optimum performance. This balancing act is especially important in designs for digital applications where shrinking packaging size makes it increasingly difficult to remove heat. For best results, the heat sink should be designed specifically to fit the application. An optimum design significantly lowers final product cost: increases reliability, and shortens product time-to-market. It can even enhance electrical performance, such as with computer chips where clock speed is related to junction temperature
  • Keywords
    circuit CAD; cooling; heat sinks; integrated circuit packaging; integrated circuit reliability; thermal analysis; clock speed; digital applications; electrical performance; final product cost; heat sink design; junction temperature; optimum performance; packaging size; product time-to-market; reliability; thermal analysis software; Application software; Computational fluid dynamics; Design engineering; Electric resistance; Equations; Geometry; Heat engines; Heat sinks; Heat transfer; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Industries Forum of New England, 1997. Professional Program Proceedings
  • Conference_Location
    Boston, MA
  • Print_ISBN
    0-7803-3987-8
  • Type

    conf

  • DOI
    10.1109/EIF.1997.605373
  • Filename
    605373