Mechanical properties and adhesion measurements of films used in advanced packages

Author

Guzman, Melissa Shell-De ; Hack, Mary ; Neubaue, Gabi

Author_Institution

Intel Corp., Santa Clara, CA, USA

fYear

1994

fDate

11-14 April 1994

Firstpage

108

Lastpage

113

Abstract

"Depth-sensing" ultra micro-indentation is a novel method for measuring the hardness, elastic modulus, and adhesion of films as thin as 0.4 micrometers. Three different techniques can be employed to determine these mechanical properties. The first part of this paper describes each technique. The second part of this paper presents two applications that employ these techniques to measure the properties of various materials used in advanced integrated circuit packages, including polyimide die coat modulus and adhesion, and SnPb solder plate hardness.<>

Keywords

adhesion; circuit reliability; hardness testing; integrated circuit testing; packaging; polymer films; adhesion measurements; advanced packages; depth-sensing ultra micro-indentation; elastic modulus; hardness; integrated circuit packages; polyimide die coat modulus; solder plate hardness; Adhesives; Bonding forces; Integrated circuit packaging; Mechanical factors; Mechanical variables measurement; Optical films; Plastics; Size measurement; Stress; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium, 1994. 32nd Annual Proceedings., IEEE International

Conference_Location

San Jose, CA, USA

Print_ISBN

0-7803-1357-7

Type

conf

DOI

10.1109/RELPHY.1994.307849

Filename

307849