DocumentCode
1957062
Title
Ambient moisture characterization of thin small outline packages (TSOPs)
Author
Prud´homme, M.
Author_Institution
Motorola Inc., Austin, TX, USA
fYear
1994
fDate
11-14 April 1994
Firstpage
79
Lastpage
86
Abstract
Two types of TSOPs were characterized with ambient preconditioning stresses to determine their true moisture sensitivity to solder reflow induced damage. The results reveal that traditional accelerated preconditioning stresses do not properly predict this package´s moisture sensitivity. Furthermore, the current model for predicting reflow damage may be ineffective for thinner packages since it only considers the amount of moisture absorbed and not the distribution of moisture.<>
Keywords
circuit reliability; life testing; moisture measurement; packaging; soldering; TSOPs; ambient moisture characterization; moisture sensitivity; preconditioning stresses; solder reflow induced damage; thin small outline packages; Absorption; Acoustic pulses; Adhesives; Delamination; Lead; Moisture; Plastic packaging; Stress; Surface-mount technology; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1994. 32nd Annual Proceedings., IEEE International
Conference_Location
San Jose, CA, USA
Print_ISBN
0-7803-1357-7
Type
conf
DOI
10.1109/RELPHY.1994.307853
Filename
307853
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