Title :
Proceedings of 1994 IEEE International Reliability Physics Symposium
Keywords :
dielectric thin films; electromigration; electrostatic discharge; failure analysis; hot carriers; integrated circuit technology; metallisation; optoelectronic devices; packaging; reliability; semiconductor process modelling; semiconductor-insulator boundaries; ESD; SOI; built-in reliability; compound semiconductor devices; dielectrics; electronic packaging; failure analysis; hot carriers; interconnect electromigration; latchup simulation; mechanical stress related electromigration; metallization; photonics; reliability physics;
Conference_Titel :
Reliability Physics Symposium, 1994. 32nd Annual Proceedings., IEEE International
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-1357-7
DOI :
10.1109/RELPHY.1994.307866
