Title :
Structural and strain relaxation study of epitaxially grown nano-thick Nd2O3/Si(111) heterostructure
Author :
Wang, Jinxing ; Laha, A. ; Fissel, Andreas ; Schwendt, D. ; Dargis, Rytis ; Watahiki, Tatsuro ; Shayduk, Roman ; Braun, Wolfgang ; Liu, Tianmo ; Osten, H. Jorg
Author_Institution :
Inst. of Electron. Mater. & Devices, Hannover Leibniz Univ., Hannover
Abstract :
This paper presents experimental work on studying the detailed structure and strain relaxation of nanometer thick Nd2O3 films epitaxially grown on Si(111) substrates using molecular beam epitaxy (MBE). Investigations by various diffraction methods demonstrate that the Nd2O3 layers exhibit a well-ordered cubic bixbyite structure with a single orientation, perfect crystallinity and a sharp interface. The epitaxial relationship between the Nd2O3 layer and the Si substrate is [111]Nd2O3//[111]Si and [1-10]Nd2O3//[-110]Si. Three-fold in-plane symmetry is observed by both in-situ reflection high-energy electron diffraction after growth and ex situ X-ray diffraction Phi-cone scans. By two orthogonal X-ray diffraction scans with high resolutions, the out-of-plane and in-plane lattice mismatches between an 8 nm Nd2O3 layer and Si substrate were precisely estimated to be 3.25% and 0.66% (if we consider two Si unit cells), respectively. We conclude that the 8 nm Nd2O3 layer is partially relaxed with a compressive strain of -1.32% in the in-plane direction and a tensile strain of 1.22% in the out-of-plane directions.
Keywords :
X-ray diffraction; internal stresses; molecular beam epitaxial growth; neodymium compounds; thin films; Nd2O3; Si; compressive strain; molecular beam epitaxy; orthogonal X-ray diffraction; size 8 nm; strain relaxation; three-fold in-plane symmetry; Capacitive sensors; Crystallization; Electrons; Lattices; Molecular beam epitaxial growth; Neodymium; Optical reflection; Substrates; Tensile strain; X-ray diffraction; GIXD; Molecular beam epitaxy; Nd2O3; Strain relaxation;
Conference_Titel :
Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
Conference_Location :
Shenzhen
Print_ISBN :
978-1-4244-4629-2
Electronic_ISBN :
978-1-4244-4630-8
DOI :
10.1109/NEMS.2009.5068613