• DocumentCode
    1957604
  • Title

    Electrical fast transient tests: applications and limitations

  • Author

    Martzloff, Françis D. ; Leedy, Thomas F.

  • Author_Institution
    Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
  • fYear
    1989
  • fDate
    1-5 Oct. 1989
  • Firstpage
    1625
  • Abstract
    The IEC Electrical Fast Transient (EFT) test was performed on two line configurations selected as typical of low-voltage power lines: a three-conductor line in a steel conduit and a three-conductor cable with a nonmetallic jacket. An attenuation model that provides a tool for understanding the significance of the line parameters and extends the usefulness of results to general cases is proposed. The two line configurations and their models yield similar results for measurements and for computations. Some differences might be expected between the quasi-coaxial configuration of a conduit-enclosed line and the open-line configuration with unshielded conductors of a nonmetallic jacket. The effects of propagation of an EFT pulse in the lines are a reduction in the amplitude, a decrease in the steepness of the front, and an increase in the duration of the pulse. The first two effects reduce the severity of a pulse arriving at the victim equipment; the third effect is less significant for victim equipment sensitive to rate-of-change disturbances. It is concluded that equipment likely to be installed close to sources of EFT pulses would benefit from immunity demonstration.<>
  • Keywords
    cable sheathing; conductors (electric); power cables; testing; transients; EFT; IEC electrical fast transient test; LV power lines; attenuation model; nonmetallic jacket; quasi-coaxial configuration; rate-of-change disturbances; steel conduit; three-conductor cable; three-conductor line; Circuit testing; Control systems; Frequency; IEC; Immunity testing; Insulation testing; Logic devices; NIST; Surge protection; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industry Applications Society Annual Meeting, 1989., Conference Record of the 1989 IEEE
  • Conference_Location
    San Diego, CA, USA
  • Type

    conf

  • DOI
    10.1109/IAS.1989.96859
  • Filename
    96859