Title :
Dynamic thermal simulation applied to automotive electronics
Author :
Brock, T.R. ; Cooper, A.J.
Author_Institution :
Rover Group Ltd., Gaydon, UK
Abstract :
Automotive electronics face significant problems when dealing with power dissipation. The engine compartment of a vehicle, for example often contains high localised temperatures, which escalates the possibility of circuit failure. This paper presents a technique to solve a dynamic thermal analysis problem. The engineers at Rover Group Ltd., successfully use a simulator in conjunction with system modelling blocks and macro modelling techniques to predict the behaviour of an ignition coil circuit suffering from device self-heating
Keywords :
CAD; automotive electronics; circuit analysis computing; cooling; digital simulation; electric ignition; heat sinks; thermal analysis; CAD; automotive electronics; circuit failure; digital simulation; heat sinks; ignition coil circuit; macro modelling techniques; power dissipation; self-heating; simulator; system modelling blocks; thermal simulation;
Conference_Titel :
Computer Aided Engineering of Automotive Electronics, IEE Colloquium on
Conference_Location :
London