DocumentCode :
1957732
Title :
Multi-dimensional Model Based Engineering Using AADL
Author :
Lewis, Bruce ; Feiler, Peter
Author_Institution :
Software Eng. Directorate, US Army RD&E Command, Huntsville, AL
fYear :
2008
fDate :
2-5 June 2008
Abstract :
The Architecture Analysis & Design Language, (AADL), Society of Automotive Engineers (SAE), AS5506, was developed to support quantitative analysis of the runtime architecture of the embedded software system in computer systems with multiple critical operational properties, such as responsiveness, safety-criticality, security, and reliability by allowing a model of the system to be annotated with information relevant to each of these quality concerns and AADL to be extended with analysis-specific properties. It supports modelling of the embedded software runtime architecture, the computer system hardware, and the interface to the physical environment of embedded computer systems and system of systems. It was designed to support a full model based engineering lifecycle including system specification, analysis, system tuning, integration, and upgrade by supporting modelling and analysis at multiple levels of fidelity. A system can be automatically integrated from AADL models when fully specified and when source code is provided for the software components.
Keywords :
embedded systems; formal specification; security of data; software architecture; software reliability; systems analysis; Architecture Analysis & Design Language; computer systems; embedded software system; model based engineering lifecycle; multidimensional model based engineering; multiple critical operational properties; reliability; responsiveness; runtime architecture; safety-criticality; security; Automotive engineering; Computer architecture; Computer interfaces; Design engineering; Embedded computing; Embedded software; Information analysis; Physics computing; Reliability engineering; Runtime;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Rapid System Prototyping, 2008. RSP '08. The 19th IEEE/IFIP International Symposium on
Conference_Location :
Monterey, CA
ISSN :
1074-6005
Print_ISBN :
978-0-7695-3180-9
Type :
conf
DOI :
10.1109/RSP.2008.40
Filename :
4550880
Link To Document :
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