Title :
High-precision flip-chip technology for alloptical wavelength conversion using SOI photonic circuit
Author :
Zimmermann, L. ; Preve, G.B. ; Voigt, K. ; Winzer, G. ; Kreissl, J. ; Moerl, L. ; Stamatiadis, C. ; Stampoulidis, L. ; Avramopoulos, H.
Author_Institution :
IHP Microelectron. GmbH, Frankfurt (Oder), Germany
Abstract :
High-precision hybrid integration on SOI photonic circuit was developed. The technology was applied to fabricate an integrated high-speed all-optical wavelength converter. Potential of the platform was demonstrated by 40Gb/s all-optical wavelength switching.
Keywords :
flip-chip devices; integrated optics; optical fabrication; optical switches; optical wavelength conversion; silicon-on-insulator; SOI photonic circuit; Si; bit rate 40 Gbit/s; high-precision flip-chip technology; high-precision hybrid integration; integrated high-speed all-optical wavelength converter; optical wavelength switching; Chirp; Optical fibers; Optical filters; Optical interferometry; Optical wavelength conversion; Semiconductor optical amplifiers;
Conference_Titel :
Group IV Photonics (GFP), 2011 8th IEEE International Conference on
Conference_Location :
London
Print_ISBN :
978-1-4244-8338-9
DOI :
10.1109/GROUP4.2011.6053775
