DocumentCode
1958282
Title
Effects of Source Access Resistance on Gate lag in AlGaN/GaN HEMTs and Current Slump Behavior
Author
Horio, K. ; Nakajima, A. ; Itagaki, K.
Author_Institution
Shibaura Inst. of Technol., Saitama
fYear
2007
fDate
18-20 June 2007
Firstpage
67
Lastpage
68
Abstract
In summary, two-dimensional transient simulations of AIGaN/GaN HEMTs have been made in which a deep donor and a deep acceptor are considered in the buffer layer. The lag phenomena and current slump could be reproduced. Particularly, it has been shown that the gate lag is correlated with relatively high source access resistance of AIGaN/GaN HEMTs, and that the drain lag could be a major cause of current slump. It is concluded that an acceptor density in the buffer layer should be made low to minimize current slump, although current cutoff behavior may be degraded when the gate length becomes short.
Keywords
aluminium compounds; buffer layers; gallium compounds; high electron mobility transistors; impurity states; transient analysis; AlGaN-GaN; HEMT; acceptor density; buffer layer; current slump behavior; gate lag phenomena; source access resistance effect; two-dimensional transient simulations; Aluminum gallium nitride; Buffer layers; Current slump; Electrons; Energy states; Gallium nitride; HEMTs; MODFETs; Radio frequency; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference, 2007 65th Annual
Conference_Location
Notre Dame, IN
ISSN
1548-3770
Print_ISBN
978-1-4244-1101-6
Electronic_ISBN
1548-3770
Type
conf
DOI
10.1109/DRC.2007.4373653
Filename
4373653
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