• DocumentCode
    1958282
  • Title

    Effects of Source Access Resistance on Gate lag in AlGaN/GaN HEMTs and Current Slump Behavior

  • Author

    Horio, K. ; Nakajima, A. ; Itagaki, K.

  • Author_Institution
    Shibaura Inst. of Technol., Saitama
  • fYear
    2007
  • fDate
    18-20 June 2007
  • Firstpage
    67
  • Lastpage
    68
  • Abstract
    In summary, two-dimensional transient simulations of AIGaN/GaN HEMTs have been made in which a deep donor and a deep acceptor are considered in the buffer layer. The lag phenomena and current slump could be reproduced. Particularly, it has been shown that the gate lag is correlated with relatively high source access resistance of AIGaN/GaN HEMTs, and that the drain lag could be a major cause of current slump. It is concluded that an acceptor density in the buffer layer should be made low to minimize current slump, although current cutoff behavior may be degraded when the gate length becomes short.
  • Keywords
    aluminium compounds; buffer layers; gallium compounds; high electron mobility transistors; impurity states; transient analysis; AlGaN-GaN; HEMT; acceptor density; buffer layer; current slump behavior; gate lag phenomena; source access resistance effect; two-dimensional transient simulations; Aluminum gallium nitride; Buffer layers; Current slump; Electrons; Energy states; Gallium nitride; HEMTs; MODFETs; Radio frequency; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Device Research Conference, 2007 65th Annual
  • Conference_Location
    Notre Dame, IN
  • ISSN
    1548-3770
  • Print_ISBN
    978-1-4244-1101-6
  • Electronic_ISBN
    1548-3770
  • Type

    conf

  • DOI
    10.1109/DRC.2007.4373653
  • Filename
    4373653