• DocumentCode
    1958296
  • Title

    Design and fabrication of the microplasma reactor for maskless scanning plasma etching

  • Author

    Wen, Li ; Zhang, Qiuping ; Xiang, Weiwei ; Wang, Hai ; Chu, Liaru

  • Author_Institution
    Dept. of Precision Machinery & Precision Instrum., Univ. of Sci. & Technol. of China, Hefei
  • fYear
    2009
  • fDate
    5-8 Jan. 2009
  • Firstpage
    577
  • Lastpage
    580
  • Abstract
    A novel maskless micro-nano plasma etching system based on parallel probe actuation is proposed. The advantages of this system are high etching rate, high fidelity, simple-structure, and flexible to fabricate various material. As a key component of the system, a microplasma reactor of metal-dielectric-metal sandwich structure with inverted, square pyramidal hollow cathode is designed and successfully fabricated with good quality. Experiment results show that the devices can discharge stably, and the V-I characteristics of the microdischarge at 4 Kpa~16 KPa of Ar and SF6/Ar gas mixture are also presented. The results of this paper may lay a foundation for further maskless scanning plasma etching.
  • Keywords
    argon; cathodes; discharges (electric); plasma sources; plasma transport processes; sputter etching; sulphur compounds; Ar; SF6-Ar; V-I characteristics; etching rate; maskless scanning plasma etching; metal-dielectric-metal sandwich structure; microdischarge; micronano plasma etching system; microplasma reactor design; microplasma reactor fabrication; parallel probe actuation; pressure 4 kPa; square pyramidal hollow cathode; Argon; Cathodes; Etching; Fabrication; Inductors; Plasma applications; Plasma materials processing; Plasma properties; Probes; Sandwich structures; V-I characteristicstic; etching; microfabrication; microplasma;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems, 2009. NEMS 2009. 4th IEEE International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-4244-4629-2
  • Electronic_ISBN
    978-1-4244-4630-8
  • Type

    conf

  • DOI
    10.1109/NEMS.2009.5068646
  • Filename
    5068646